WARP 3D Sensor Chip for Extreme Profiling Speeds
The Widely Advanced Rapid Profiling (WARP) Technology powering the C6 Profile Scanners enable unprecedented profiling speeds of up to 200 kHz. This proprietary processing technology allows for a 3D point data rate of up to 128 M/s. Combined with resolutions up to 4,096 pixels and intelligent algorithms optimized for 3D profiling data, it’s possible to profile at extreme speeds while minimizing noise to provide only the most relevant data for your application.
More Targets, More Information, Less Noise
The C6 Profile Scanners come equipped with proprietary MultiPart and MultiPeak functionalities to enhance the capabilities of what’s possible with profile scanning. MultiPart makes it possible to output significantly more features, regardless of the pixel format and algorithm. This includes altitude values, intensity data, reflectance to evaluate contrast representation, and scatter value to analyze surface quality. MultiPeak enables noise-free recording of 3D profile data for the first time, including on highly-reflective materials such as metal, plastic, or glass. This enables laser reflections to be checked for plausibility and any disturbances to be eliminated from the data.
Versatile & Flexible Software Support & SDK
Simplify integration and optimize performance with a robust software ecosystem that’s designed for 3D metrology applications. C6 Profile Scanners come with an easy-to-use SDK, multiple support packages, standard APIs, and a variety of tools to make it as user-friendly as possible. Combined with a vast set of documentation, it’s never been faster & easier to get started with 3D profiling technology.
High Accuracy Sensors
Large selection of case sizes and measuring ranges
- X-Measuring range (Width) from 7mm to 1,290mm
- Z-Measuring range (Height) from 5.2mm to 1,090mm
- Working distances from 31mm to 920mm
- Laser wavelength blue (405/450 nm) or red (660 nm)
- X Resolutions from 5µm to 630µm
- Z Resolutions from 0.2µm to 38µm